简介:Inthispaper,a3Dsourcedistributiontechniqueisusedtocalculatethecoupledmotionsbetweentwoshipswhichadvanceinthewavewiththesamespeed.Thenumericalresultsofcoupledmotionsforafrigateandasupplyshiphaveagoodagreementwiththeexperimentalresults.Basedonthe3Dcoupledmotionsoftwoships,aspectralanalysisisemployedtoclearlyobservetheeffectofspeed,clearanceandwaveheadingonthesignificantrelativemotionamplitude(SRMA)oftwoships.Themethodpresentedinthispaperwillbehelpfultoselectsuitableclearance,speedandwaveheadingforunderwayreplenishmentatsea(RAS).
简介:目前,3D打印技术在飞速发展,但3D打印机又重又贵,就连好奇心这么强的东子哥哥我也常常"望机兴叹"。不过,最近有好消息传来,国外设计师设计了方便又小巧的3D涂鸦笔,售价仅仅32美元,它能让3D技术真正走进人们的生活。3D涂鸦笔在"笔尖"整合了3D打印机的"打印端"技术。
简介:Thispaperpresentsanewalgorithmforgenerating3DimagesofB-repsobjectswithtrimmedsurfaceboundaries.The3Dimageisadiscretevoxel-maprepresentationwithinaCubicFrameBuffer(CFB).Thedefinitionof3Dimagesforcurve,surfaceandsolidobjectareintroducedwhichimplytheconnectivityandfidelityrequirements.AdaptiveForwardDifferencingmatrix(AFD-matrix)for1D-3Dmanifoldsin3Dspaceisdeveloped.BysettingrulestoupdatetheAFD-matrix,theforwarddifferencedirectionandstepwisecanbeadjusted.Finally,anefficientalgorithmispresentedbasedontheAFD-matrixconceptforconvertingtheobjectin3Dspaceto3Dimagein3Ddiscretespace.
简介:Thetraditionalstrategyof3Dmodelreconstructionmainlyconcentratesonorthographicprojectionsorengineeringdrawings.Buttherearesomeshortcomings.Suchas,onlyfewkindsofsolidscanbereconstructed,thehighcomplexityoftimeandlessinformationaboutthe3Dmodel.Theresearchisextendedandprocesscardistreatedaspartofthe3Dreconstruction.Asetofprocessdataisasupersetof2Dengineeringdrawingsset.Thesetcomprisesprocessdrawingsandprocesssteps,andshowsasequencingandasymptoticcoursethatapartismadefromroughcastblanktofinalproduct.Accordingtothesecharacteristics,theobjecttobereconstructedistranslatedfromthecomplicatedengineeringdrawingsintoaseriesofmuchsimplerprocessdrawings.Withtheplentifulprocessinformationaddedforreconstruction,thedisturbancessuchasirrelevantgraph,symbolandlabel,etc.canbeavoided.Andmore,theformchangeofbothneighborprocessdrawingsissolittlethattheengineeringdrawingsinterpretationhasnodifficulty;inaddition,theabnormalsolutionandmulti-solutioncanbeavoidedduringreconstruction,andtheproblemsofbeingapplicabletomoreobjectsissolvedultimately.Therefore,theutilitymethodfor3Dreconstructionmodelwillbepossible.Ontheotherhand,thefeatureinformationinprocesscardsisprovidedforreconstructionmodel.Focusingonprocesscards,thefeasibilityandrequirementsofWorkingProcedureModelreconstructionisanalyzed,andthemethodtoapplyandimplementtheNaturalLanguageUnderstandingintothe3Dreconstructionisstudied.Themethodofasymptoticapproximationproductwasproposed,bywhicha3Dprocessmodelcanbeconstructedautomaticallyandintelligently.Theprocessmodelnotonlyincludestheinformationaboutpartscharacters,butalsocandelivertheinformationofdesign,processandengineeringtothedownstreamapplications.
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简介:Seismicdataacquiredinseabeachwasaffectedbylargevariationsinnear-surfacemedia,seriousreceiverdrifting,serioushigh-frequencynoises,heavymultiples,complexsubsurfacegeologyanddifficultiesinimaging.BGPResearchInstitute,havingworkedonthecorrespondingissuesforseveralyears,hascompletedaseriesofcomplexseabeach3Dseismicinterpretationapproachesincludingsyntheticseismiccalibrationwithdirectionalwelldata,analysisofstressfield,correlatinginterpretationwithmulti-screenmulti-linerecursion,
简介:3Dprintingisdisruptingthedesignandmanufactureofelectronicproducts.3Dprintingelectronicsoffersgreatpotentialtobuildcomplexobjectwithmultiplefunctionalities.Particularly,ithasshowntheuniqueabilitytomakeembeddedelectronics,3Dstructuralelectronics,conformalelectronics,stretchableelectronics,etc.3Dprintingelectronicshasbeenconsideredasthenextfrontierinadditivemanufacturingandprintedelectronics.Overthepastfiveyears,alargenumberofstudiesandeffortsregarding3Dprintingelectronicshavebeencarriedoutbybothacademiaandindustries.Inthispaper,acomprehensivereviewofrecentadvancesandsignificantachievementsin3Dprintingelectronicsisprovided.Furthermore,theprospects,challengesandtrendsof3Dprintingelectronicsarediscussed.Finally,somepromisingsolutionsforproducingelectronicswith3Dprintingarepresented.