Electrochemical behavior of Cu-Zn-Al shape memory alloy after surface modification by electroless plated Ni-P

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    摘要 TheelectrochemicalbehaviorofCu-Zn-Alshapememoryalloy(SMA)withandwithoutelectrolessplatedNi-PwasinvestigatedbyelectrochemicalmethodsinartificialTyrode'ssolution.TheresultsshowedthatCu-Zn-AlSMAengendereddezincificationcorrosioninTyrode'ssolution.TheanodicactivecurrentdensitiesaswellaselectrochemicaldissolutionsensitivityoftheelectrolessplatedNi-PCu-Zn-AlSMAincreasedwithNaClconcentrationrising,pHofsolutiondecreasingandenvironmentaltemperatureuprising.X-raydiffractionanalysisindicatedthataftersurfacemodificationbyelectrolessplatedNi-P,anamorphousplatedfilmformedonthesurfaceofCu-Zn-AlSMA.ThisfilmcaneffectivelyisolatematrixmetalfromcorrosionmediaandsignificantlyimprovetheelectrochemicalpropertyofCu-Zn-AlSMAinartificialTyrode'ssolution.
    机构地区 不详
    出处 《稀有金属:英文版》 2004年4期
    出版日期 2004年04月14日(中国Betway体育网页登陆平台首次上网日期,不代表论文的发表时间)
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